The service life of a LCA® feedthrough capacitor is not determined by a single factor, but rather by the combined result of design, selection, installation, and operating environment.
1.Correct Selection: Precise selection can prevent the vast majority of early failures and lifespan reduction.
1).Voltage Derating: Derating significantly reduces the electric field strength within the dielectric, slowing its aging process and enhancing its ability to withstand voltage surges.
2).Current and Temperature Budget:
Current: Select a model with a current rating higher than the maximum steady-state current in the circuit, and include a margin. High-frequency ripple current is a primary cause of internal heating in capacitors.
Temperature: Ensure both the capacitor’s surface temperature and the ambient temperature remain below their rated values. Typically, for every 10°C increase in operating temperature, the component’s lifespan is approximately halved.
3).Matching the Application Scenario:
Power Lines: Select models with high current ratings and high voltage withstand capabilities.
Signal Lines: Select models with low capacitance values (e.g., 10pF to 100pF) to avoid impacting signal integrity and to minimize self-loss.
2.Correct Installation: Improper installation is a primary cause of immediate failure or potential damage.
1).Strictly Control the Soldering Process: Avoid severe thermal shock. The use of preheating and natural cooling is recommended, as forced air or water cooling can cause the ceramic body to crack due to thermal stress.
2).Avoid Mechanical Stress:
Bending Leads: If lead bending is necessary, it should be performed at least 4mm away from the epoxy resin seal using supporting tools to prevent stress transfer to the internal components.
Installation Torque: For threaded types, use a torque wrench and follow specifications to avoid housing deformation or thread stripping.
3).Ensure Ideal Grounding:
Low-Impedance Path: The capacitor’s metal housing must be connected to a clean ground point (preferably the chassis ground) via a short and thick path.
Good Contact: The mounting surface should be clean and flat to ensure a low-impedance connection between the housing and the mounting surface.
——2023.10.16