• The solderingprocess must be controlled to prevent the filter from being subjected to sudden thermal shock, which can cause internal ceramic capacitor fracture.
• Preheating Rate:During preheating, the ramp-up rate should be maintained at 2°C/second. In practice, depending on the substrate and components, a successful ramp rate is often between 1.5°C/sec and 4°C/sec.
• Employing a soaking zone before soldering is highly recommended. This allows the substrate temperature to equalize, preventing distortion. During cooling, any recovery from substrate distortion can generate stress that may damage the filter.
• Solder Material:such as SN42 or similar types may be used.
• Soldering time should be controlled within 3 seconds. The soldering temperature should not exceed 300°C (suitable for solder-in feedthrough types).
• Cooling Process:Cooling to room temperature should occur naturally, allowing the thermal stress in the solder joints to gradually relax. Drafts should be avoided. Forced air cooling can cause thermal cracking. Immediately cleaning the filter with cold water after the soldering process may cause the filter to crack.
• When using different production processes, corresponding testing is necessary.
• Lead Bending & Trimming:Filter leads should not be bent within 4mm of the epoxy seal. When trimming leads, adequate support must be provided.

  ——2022.11.13